Publications

PUBLICATIONS

B. Zhang, Z. Cheng, and M. Pedram. “An Iterative Montgomery Modular Multiplication Algorithm with Low Area-Time Product,” IEEE Trans. on Computers, 2022.
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S. Asapu, J. N. Pagaduan, Y. Zhuo, R. Midya, T. Moon, D. Gao, J. Lee, Q. Wu,  M. Barnell, S. Ganguli, R. Katsumata, Y. Chen, Q. Xia, and J. Joshua Yang. “Large remnant polarization in reliable W/HZO/W ferroelectric capacitors”, Frontiers in Materials, 2022.
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Q. Shao, Z. Wang, J. Joshua Yang.“Efficient AI with MRAM,” NATURE ELECTRONICS, 2022 .
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S. Taghipour, M. Kamal, R.N. Asli, A. Afzali-Kusha, M. Pedram. “LCHC-DFT: A Low-Cost High-Coverage Design-for-Testability Technique to Detect Hard-to-Detect Faults in STT-MRAMs in the Presence of Process Variations,” IEEE Transactions on Device and Materials Reliability, 2022.
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M. Soltani, M. Kamal, A. Afzali-Kusha, and M. Pedram. “An Adaptive Memory Side Encryption Method for Improving Security and Lifetime of PCM-based Main Memory,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, 2022.
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F. Kiani, J. Yin, Z. Wang, J. Joshua Yang, and Q. Xia. “A fully hardware-based memristive multilayer neural network”, SCIENCE ADVANCES, 2021.
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S.N. Shahsavani, A. Fayyazi, M. Nazemi, M. Pedram. “Efficient Compilation and Mapping of Fixed Function Combinational Logic onto Digital Signal Processors Targeting Neural Network Inference and Utilizing High-level Synthesis,” ACM Transactions on Reconfigurable Technology and Systems (TRETS), 2022.
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M. Zolfagharinejad, M. Kamal, A. Afzali-Kusha, and M. Pedram. “Posit Process Element for Using in Energy-Efficient DNN Accelerators,” IEEE Trans. Very Large Scale Integrated Systems, 2022.
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H. Zha, N.K. Katam, M. Pedram, M. Annavaram. “HiPerRF: A Dual-Bit Dense Storage SFQ Register File”, IEEE International Symposium on High-Performance Computer Architecture (HPCA), 2022.
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Y. Zhuo, R. Midya, W. Song, Z. Wang, S. Asapu, M. Rao, P. Lin, H. Jiang, Q. Xia, R. S. Williams, J. Joshua Yang. “A Dynamical Compact Model of Diffusive and Drift Memristors for Neuromorphic Computing”, ADVANCED ELECTRONICS MATERIALS, 2021.
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A. Fayyazi, M. Munir, A. Gopikanna, S. Nazarian, and M. Pedram. “A Logic Verification Framework for SFQ and AQFP Superconducting Circuits,” IEEE Trans. on Applied Superconductivity, 2021.
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M. J. Dousti, Q. Xie, M. Nazemi, and M. Pedram, “Therminator 2: A Fast Thermal Simulator for Portable Devices,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, 2021.
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